By Daizhong Su, Qingbin Zhang, Shifan Zhu
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Additional resources for Advanced design and manufacture II
5] established impact life prediction models for thin-profile fin-pitch BGA and Quad flat No-Lead packages. Zhu and Marcinkiewicz examined the drop impact reliability of chip scale packages at board and product level through finite element analysis. Various drop tests have been used to ensure high reliability performance of packaging. There are three types of drop test in the electronic industry: (1) bare board drop; (2) board with fixture drop; (3) product system drop. Board level drop test is convenient to characterize the solder joint performance, because it is more controllable than product level drop test.
2(b). It is difficult to forge a gear with sharp points. To increase the forge-ability of gear, all segments of tooth profile are integrated as a cubic spline function, with which the tooth profile can be represented by discrete points. As shown in Fig. 2(b), n discrete points with given coordinates can determine (n-1) third order polynomial functions. 2) where ti = ( xi(+t 1) − xi(t ) )2 + ( yi(+t 1) − yi(t ) )2 , ( xi( t ) , yi( t ) ) are sampling points on tooth profile and ti is cumulated arc length.
After the simulation of forging of two versions of micro-spur-gears, the curves of load versus time are compared as shown in Fig. 4. 56N. Conclusions In this paper, a cubic spline function model for involute spur-micro-gear is used to increase the smoothness of profile. To increase the forge-ability, the sharp point is modified by a rounded corner. Compared with the traditional involute profile, the modified profile has a smaller minimum number of teeth of non-undercutting. By using forging simulation software DEFROM, the forge-ability of the modified profile is better than the traditional one.